Molecular Dynamics Simulation of Copper Nanofilm Self-Assembly on Silicon Substrate under Gas-Discharge Plasma Conditions
Crossref DOI link: https://doi.org/10.1134/S0018143921050039
Published Online: 2021-09-22
Published Print: 2021-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fairushin, I. I.
Shemakhin, A. Yu.
Khabir’yanova, A. A.
Text and Data Mining valid from 2021-09-01
Version of Record valid from 2021-09-01
Article History
Received: 5 February 2021
Revised: 28 April 2021
Accepted: 11 May 2021
First Online: 22 September 2021