Simulation of Copper Nanostructure Formation on Silicon Dioxide Microsubstrate Surface
Crossref DOI link: https://doi.org/10.1134/S001814392307010X
Published Online: 2023-09-08
Published Print: 2023-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fairushin, I. I.
Shemakhin, A. Yu.
Text and Data Mining valid from 2023-09-08
Version of Record valid from 2023-09-08
Article History
Received: 10 April 2023
Revised: 10 April 2023
Accepted: 10 April 2023
First Online: 8 September 2023
CONFLICT OF INTEREST
: The authors declare that they have no conflicts of interest.