Two-Side Growth of the Cu9Ga4 Phase during the Interfacial Reactions between Sn–Ag–Cu–Ga Solders and Copper Substrates
Crossref DOI link: https://doi.org/10.1134/S0031918X18090168
Published Online: 2019-06-17
Published Print: 2019-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wenjing Wang,
Chen, HuiMing
Chen, Jinshui
Gong, Liukui
Wang, Hang
Text and Data Mining valid from 2019-05-01
Version of Record valid from 2019-05-01
Article History
Received: 10 February 2017
Revised: 14 February 2018
Accepted: 3 April 2018
First Online: 17 June 2019