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Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys

Published Online: 2023-12-29

Published Print: 2023-12

Authors

Sezen Aksöz,

Öcal, Fadimana

Esener, Pınar Ata

Öztürk, Esra

Maraşlı, Necmettin
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Text and Data Mining valid from 2023-12-01

Version of Record valid from 2023-12-01
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Article History

Received: 3 November 2022

Revised: 7 July 2023

Accepted: 28 July 2023

First Online: 29 December 2023

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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