Thermal Conductivity of Low-Alloy Copper for Molds
Crossref DOI link: https://doi.org/10.1134/S0036029518030035
Published Online: 2018-07-06
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dubskii, G. A.
Vdovin, K. N.
Nefed’ev, A. A.
Egorova, L. G.
Text and Data Mining valid from 2018-03-01
Article History
Received: 18 January 2017
First Online: 6 July 2018