Diffusion at the Film–Substrate Interface during Nickel Electrocrystallization on a Copper Substrate
Crossref DOI link: https://doi.org/10.1134/S1027451018020362
Published Online: 2018-04-25
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shtapenko, E. F.
Zabludovsky, V. A.
Tytarenko, V. V.
Text and Data Mining valid from 2018-03-01
Article History
Received: 10 June 2017
First Online: 25 April 2018