Simulation of the Deposition of Thin-Film Materials Used in the Manufacturing of Devices with Miniaturized Circuits
Crossref DOI link: https://doi.org/10.1134/S1027451022060283
Published Online: 2022-12-12
Published Print: 2022-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Abdelkader Bouazza,
Text and Data Mining valid from 2022-12-01
Version of Record valid from 2022-12-01
Article History
Received: 31 March 2022
Revised: 28 May 2022
Accepted: 28 May 2022
First Online: 12 December 2022
CONFLICT OF INTEREST
: The authors declare that they have no conflicts of interest.