Control of Mask Erosion and Correction of Structure Profile in an Adapted Process of Deep Reactive Ion Etching of Silicon
Crossref DOI link: https://doi.org/10.1134/S102745102470126X
Published Online: 2025-03-01
Published Print: 2024-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Morozov, O. V.
Text and Data Mining valid from 2024-12-01
Version of Record valid from 2024-12-01
Article History
Received: 11 February 2024
Revised: 14 April 2024
Accepted: 14 April 2024
First Online: 1 March 2025
CONFLICT OF INTEREST
: The author of this work declares that he has no conflicts of interest.