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Study of the Ultrafine-Grained Copper Structure Formed by Dynamic Recrystallization by Analyzing the Etched Surface Relief

Published Online: 2025-10-28

Published Print: 2025-10

Authors

Stolbovsky, A. V.

Chikunova, N. S.

Blinov, I. V.
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Text and Data Mining valid from 2025-10-01

Version of Record valid from 2025-10-01
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Article History

Received: 29 May 2025

Revised: 2 June 2025

Accepted: 23 June 2025

First Online: 28 October 2025

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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