Estimating the reliability of aluminum metallization of integrated circuits by accelerated electromigration testing at constant temperature
Crossref DOI link: https://doi.org/10.1134/S1063739715070148
Published Online: 2015-11-14
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Safonov, S. O.
Bespalov, V. P.
Golishnikov, A. A.
Putrya, M. G.
Text and Data Mining valid from 2015-11-14