Modeling of the high aspect groove etching in Si in a Cl2/Ar mixture plasma
Crossref DOI link: https://doi.org/10.1134/S1063739716030070
Published Online: 2016-05-19
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shumilov, A. S.
Amirov, I. I.
Lukichev, V. F.
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