Document is current

Any future updates will be listed below

Modeling the Dynamics of the Integral Dielectric Permittivity of a Porous Low-K Organosilicate Film during the Dry Etching of a Photoresist in O2 Plasma

Crossref DOI link: https://doi.org/10.1134/S1063739718060057

Published Online: 2019-03-13

Published Print: 2018-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark