Structural Strength and Temperature Condition of Multi-Chip Modules
Crossref DOI link: https://doi.org/10.1134/S1063739718070090
Published Online: 2019-03-13
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pogalov, A. I.
Blinov, G. A.
Chugunov, E. Yu.
Text and Data Mining valid from 2018-11-01
Article History
Received: 1 April 2016
First Online: 13 March 2019