Parameters of Plasma and Way of Etching Silicon in a CF4 + CHF3 + O2 Mixture
Crossref DOI link: https://doi.org/10.1134/S1063739719060040
Published Online: 2020-01-14
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Efremov, A. M.
Murin, D. B.
Kwon, K.-H.
Text and Data Mining valid from 2019-11-01
Version of Record valid from 2019-11-01
Article History
Received: 28 January 2019
Revised: 28 January 2019
Accepted: 25 April 2019
First Online: 14 January 2020