Plasma-Chemical and Reactive-Ion Etching of Silicon in Tetrafluoromethane with Argon
Crossref DOI link: https://doi.org/10.1134/S106373972203009X
Published Online: 2022-07-12
Published Print: 2022-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Murin, D. B.
Pivovarenok, S. A.
Kozin, A. S.
Text and Data Mining valid from 2022-07-12
Version of Record valid from 2022-07-12
Article History
Received: 7 July 2021
Revised: 11 January 2022
Accepted: 11 January 2022
First Online: 12 July 2022