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Peculiarities of the Kinetics of Heterogeneous Processes during the Etching of Silicon in CF4 and C2Br2F4 Plasma

Crossref DOI link: https://doi.org/10.1134/S1063739722700032

Published Online: 2022-12-23

Published Print: 2022-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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