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Kinetics of Electromigration Mass Transfer in the Interface Elements of Micro- and Nanoelectronics Depending on the Strength of Thin-Film Connections

Published Online: 2024-07-26

Published Print: 2024-06

Authors

Makhviladze, T. M.

Sarychev, M. E.
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Text and Data Mining valid from 2024-06-01

Version of Record valid from 2024-06-01
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Article History

Received: 15 February 2024

Revised: 20 March 2024

Accepted: 20 March 2024

First Online: 26 July 2024

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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