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Research and Development of a Deep Anisotropic Silicon Plasma Etching Process with Reduced Sidewall Roughness of the Structures

Published Online: 2025-02-10

Published Print: 2024-12

Authors

Golishnikov, A. A.

Dyuzhev, N. A.

Paramonov, V. V.

Potapenko, I. V.

Putrya, M. G.

Somov, N. M.

Chaplygin, Yu. A.
License Information

Text and Data Mining valid from 2024-12-01

Version of Record valid from 2024-12-01
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Article History

Received: 10 August 2023

Revised: 23 August 2023

Accepted: 24 October 2023

First Online: 10 February 2025

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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