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Impact of Various Core Materials on the Behavior of Through-Silicon via (TSV) Inductor in a DC/DC Converter

Published Online: 2025-11-27

Published Print: 2025-10

Authors

Katepogu Rajkumar,

Latha, J. Sneha

Nannepaga, Bujjibabu

Reddy, G. Umamaheswara
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Text and Data Mining valid from 2025-10-01

Version of Record valid from 2025-10-01
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Article History

Received: 14 April 2025

Revised: 15 July 2025

Accepted: 20 July 2025

First Online: 27 November 2025

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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