Impact of the Device Geometric Parameters on Hot-Carrier Degradation in FinFETs
Crossref DOI link: https://doi.org/10.1134/S1063782618130183
Published Online: 2018-12-24
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tyaginov, S. E.
Makarov, A. A.
Kaczer, B.
Jech, M.
Chasin, A.
Grill, A.
Hellings, G.
Vexler, M. I.
Linten, D.
Grasser, T.
Text and Data Mining valid from 2018-12-01
Article History
Received: 12 March 2018
Accepted: 16 April 2018
First Online: 24 December 2018