Influence of the Silicon Dioxide Layer Thickness on Electroforming in Open TiN–SiO2–W Sandwiches
Crossref DOI link: https://doi.org/10.1134/S106378421811018X
Published Online: 2018-11-22
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mordvintsev, V. M.
Kudryavtsev, S. E.
Levin, V. L.
Text and Data Mining valid from 2018-11-01
Article History
Received: 10 November 2017
First Online: 22 November 2018