Thermal-Conductive Boards Based on Aluminum with an Al2O3 Nanostructured Layer for Products of Power Electronics
Crossref DOI link: https://doi.org/10.1134/S1063784218110191
Published Online: 2018-11-22
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Muratova, E. N.
Moshnikov, V. A.
Luchinin, V. V.
Bobkov, A. A.
Vrublevsky, I. A.
Chernyakova, K. V.
Terukov, E. I.
Text and Data Mining valid from 2018-11-01
Article History
Received: 14 September 2017
First Online: 22 November 2018