Substructure of Intermetallic Thin-Film Cu3Sn
Crossref DOI link: https://doi.org/10.1134/S1063784219060112
Published Online: 2019-06-24
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mokrushina, A. N.
Plotnikov, V. A.
Dem’yanov, B. F.
Makarov, S. V.
Text and Data Mining valid from 2019-06-01
Version of Record valid from 2019-06-01
Article History
Received: 1 August 2018
Revised: 1 August 2018
Accepted: 1 December 2018
First Online: 24 June 2019