Designing new adhesive materials based on epoxy oligomers filled with organic compounds
Crossref DOI link: https://doi.org/10.1134/S1995421215020136
Published Online: 2015-04-28
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pestov, A. V.
Kuznetsov, V. A.
Mekhaev, A. V.
Gorbunova, T. I.
Saloutin, V. I.
Smirnov, S. V.
Vichuzhanin, D. I.
Matafonov, P. P.
Text and Data Mining valid from 2015-04-01