Conductive Material Based on Copper Powder with Improved Mechanical Properties
Crossref DOI link: https://doi.org/10.1134/S2075113320020240
Published Online: 2020-04-13
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Meilakh, A. G.
Kontsevoi, Yu. V.
Melchakov, S. Yu.
Dolmatov, A. V.
Text and Data Mining valid from 2020-03-01
Version of Record valid from 2020-03-01
Article History
Received: 20 March 2019
Revised: 30 May 2019
Accepted: 31 May 2019
First Online: 13 April 2020