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Technology for Manufacturing TSV Structures for the Creation of Silicon Interposers Using Temporary-Bonding Technology

Published Online: 2024-09-10

Published Print: 2024-04

Authors

Djuzhev, N. A.

Gusev, E. E.

Fomichev, M. Yu.

Ivanin, P. S.
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Text and Data Mining valid from 2024-04-01

Version of Record valid from 2024-04-01
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Article History

Received: 21 November 2023

Revised: 29 February 2024

Accepted: 18 April 2024

First Online: 10 September 2024

CONFLICT OF INTEREST

: The authors of this work declare that they have no conflicts of interest.

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