Temperature dependence of copper diffusion in different thickness amorphous tungsten/tungsten nitride layer
Crossref DOI link: https://doi.org/10.1134/S0031918X17100027
Published Online: 2017-11-24
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Asgary, Somayeh
Hantehzadeh, Mohammad Reza
Ghoranneviss, Mahmood
License valid from 2017-11-01