Interfacial Microstructure and Its Influence on Resistivity of Thin Layers Copper Cladding Steel Wires
Crossref DOI link: https://doi.org/10.1134/S0031918X18040105
Published Online: 2018-05-05
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Hongjuan
Ding, Zhimin
Zhao, Ruirong
Text and Data Mining valid from 2018-04-01
Article History
Received: 22 April 2016
Accepted: 10 October 2017
First Online: 5 May 2018