Simulating the chlorine plasma etching profile of high-aspect-ratio trenches in Si
Crossref DOI link: https://doi.org/10.1134/S1063739717050092
Published Online: 2017-09-14
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shumilov, A. S.
Amirov, I. I.
Luckichev, V. F.
License valid from 2017-09-01