Simulating and Ensuring the Reliability of the Elements and Joints of Three-Dimensional Microelectronics Modules
Crossref DOI link: https://doi.org/10.1134/S1063739719070114
Published Online: 2020-03-10
Published Print: 2019-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pogalov, A. I.
Blinov, G. A.
Chugunov, E. Y.
Text and Data Mining valid from 2019-12-01
Version of Record valid from 2019-12-01
Article History
Received: 30 June 2017
Revised: 30 June 2017
Accepted: 9 November 2017
First Online: 10 March 2020