Thermomechanical Strength of Element Connections in Microelectronic Modules
Crossref DOI link: https://doi.org/10.1134/S1063739720070082
Published Online: 2021-01-27
Published Print: 2020-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pogalov, A. I.
Titov, A. Yu.
Timoshenkov, S. P.
Text and Data Mining valid from 2020-12-01
Version of Record valid from 2020-12-01
Article History
Received: 9 April 2019
Revised: 9 April 2019
Accepted: 24 September 2019
First Online: 27 January 2021