Plasma Parameters and Kinetics of Reactive-Ion Etching of Silicon in a C6F12O + Ar Mixture
Crossref DOI link: https://doi.org/10.1134/S1063739722040047
Published Online: 2022-07-12
Published Print: 2022-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Efremov, A. M.
Betelin, V. B.
Kwon, K.-H.
Text and Data Mining valid from 2022-07-12
Version of Record valid from 2022-07-12
Article History
Received: 18 January 2022
Revised: 22 February 2022
Accepted: 28 February 2022
First Online: 12 July 2022