Effect of Nickel and Copper Introduced at Room Temperature on the Recombination Properties of Extended Defects in Silicon
Crossref DOI link: https://doi.org/10.1134/S1063782619040225
Published Online: 2019-05-06
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Orlov, V. I.
Yarykin, N. A.
Yakimov, E. B.
Text and Data Mining valid from 2019-04-01
Article History
Received: 13 November 2018
Revised: 20 November 2018
Accepted: 20 November 2018
First Online: 6 May 2019