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Temperature and indenter radius effects on mechanical properties of copper during nanoindentation: a molecular dynamic simulation study

Crossref DOI link: https://doi.org/10.1140/epjb/s10051-021-00253-1

Published Online: 2021-12-03

Published Print: 2021-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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