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Structural optimization of thermal stresses in BGA solder joints based on improved BP neural network-genetic algorithm

Crossref DOI link: https://doi.org/10.1140/epjp/s13360-023-04355-w

Published Online: 2023-08-14

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Haoyu https://orcid.org/0000-0003-2168-4459
Ma, Jianshe

Gong, Mali

Su, Ping
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Text and Data Mining valid from 2023-08-14

Version of Record valid from 2023-08-14
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Article History

Received: 5 March 2023

Accepted: 4 August 2023

First Online: 14 August 2023

Declarations

:

: The authors declare no competing interests.