Study on subsurface damage of wafer silicon containing through silicon via in thinning
Crossref DOI link: https://doi.org/10.1140/epjp/i2019-12591-4
Published Online: 2019-05-27
Published Print: 2019-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xu, Yixin
Wang, Miaocao
Zhu, Fulong http://orcid.org/0000-0002-0756-9051
Liu, Xiaojian
Liu, Yuhong
He, Liping
Text and Data Mining valid from 2019-05-01
Version of Record valid from 2019-05-01
Article History
Received: 27 November 2018
Accepted: 22 February 2019
First Online: 27 May 2019