Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition
Crossref DOI link: https://doi.org/10.1186/s11671-016-1378-9
Published Online: 2016-03-24
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Dong-Won
Kwon, Oh-Yun
Cho, Won-Ju
Song, Jun-Kwang
Kim, Yong-Nam
Funding for this research was provided by:
National Research Foundation of Korea (No. 2013R1A1A2A10011202)
License valid from 2016-03-24