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Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives

Crossref DOI link: https://doi.org/10.1186/s40539-014-0010-9

Published Online: 2014-09-08

Published Print: 2014-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ren, Hu-Ming

Zhang, Kai

Matthew, Yuen MF

Fu, Xian-Zhu

Sun, Rong

Wong, Ching-Ping
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License valid from 2014-09-08
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Article History

Received: 2 April 2014

Accepted: 9 June 2014

First Online: 8 September 2014