Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion
Crossref DOI link: https://doi.org/10.1186/s40563-015-0040-6
Published Online: 2015-10-13
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hofmeister, Caroline
Maaß, Sebastian
Fladung, Thorsten
Thiel, Karsten
Mayer, Bernd
License valid from 2015-10-13