Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
Crossref DOI link: https://doi.org/10.1186/1556-276X-9-541
Published Online: 2014-10-01
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shih, Jian-Yu
Chen, Yen-Chi
Chiu, Chih-Hung
Lo, Chung-Lun
Chang, Chi-Chung
Chen, Kuan-Neng
Article History
Received: 26 June 2014
Accepted: 23 September 2014
First Online: 1 October 2014