Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application
Crossref DOI link: https://doi.org/10.1186/1556-276X-9-592
Published Online: 2014-10-28
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chin, Fun-Tat
Lin, Yu-Hsien
You, Hsin-Chiang
Yang, Wen-Luh
Lin, Li-Min
Hsiao, Yu-Ping
Ko, Chum-Min
Chao, Tien-Sheng
Article History
Received: 29 June 2014
Accepted: 16 October 2014
First Online: 28 October 2014