Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
Crossref DOI link: https://doi.org/10.1186/1556-276X-9-643
Published Online: 2014-11-29
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Zifeng
Fu, Yuqiao
Meng, Wenjun
Zhi, Chunyi
Article History
Received: 3 November 2014
Accepted: 14 November 2014
First Online: 29 November 2014