Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding
Crossref DOI link: https://doi.org/10.1186/s10033-018-0266-x
Published Online: 2018-08-20
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Deng, Yun-Hua
Guan, Qiao
Tao, Jun
Wu, Bing
Funding for this research was provided by:
National Natural Science Foundation of China (No. 51705491)
Text and Data Mining valid from 2018-08-20
Article History
Received: 6 November 2016
Accepted: 6 August 2018
First Online: 20 August 2018