Effects of a Cu x O Buffer Layer on a SiO x -Based Memory Device in a Vaporless Environment
Crossref DOI link: https://doi.org/10.1186/s11671-015-1003-3
Published Online: 2015-07-14
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Chih-Yi
Huang, Zheng-Yao
License valid from 2015-07-14
Article History
Received: 12 April 2015
Accepted: 5 July 2015
First Online: 14 July 2015