Rolling Resistance and Mechanical Properties of Grinded Copper Surfaces Using Molecular Dynamics Simulation
Crossref DOI link: https://doi.org/10.1186/s11671-016-1616-1
Published Online: 2016-09-15
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liang, Shih-Wei
Wang, Chih-Hao
Fang, Te-Hua
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 103-2221-E-151-007-MY3, MOST 103-2221-E-151-001-MY3)
License valid from 2016-09-15