Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Crossref DOI link: https://doi.org/10.1186/s11671-017-1831-4
Published Online: 2017-01-19
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Wen-Wei
Chen, Kuan-Neng http://orcid.org/0000-0003-4316-0007
License valid from 2017-01-19