Experimental Study on Thermal Conductivity and Hardness of Cu and Ni Nanoparticle Packed Bed for Thermoelectric Application
Crossref DOI link: https://doi.org/10.1186/s11671-017-1969-0
Published Online: 2017-03-11
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Zi-Zhen
Huang, Cong-Liang
Zhen, Wen-Kai
Feng, Yan-Hui
Zhang, Xin-Xin
Wang, Ge
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