Fan, Cuncai
Wang, Haiyan
Zhang, Xinghang
Funding for this research was provided by:
City University of Hong Kong (9610627)
Semiconductor Research Corporation and Center for Heterogeneous Integration Research in Packaging (2878.017, 2878.017)
Division of Materials Research, U.S. National Science Foundation (2210152)
Article History
Received: 30 December 2023
Accepted: 27 February 2024
First Online: 12 March 2024
Declarations
:
: The authors declare no competing interests.