Transmission and innovation on gold granulation: the application of tin for soldering techniques in ancient China
Crossref DOI link: https://doi.org/10.1186/s40494-022-00753-y
Published Online: 2022-08-04
Published Print: 2022-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shi, Yong
Wen, Yadi
Li, Xiaojun
Liu, Zhaojian
Huang, Yumin
He, Bei
Text and Data Mining valid from 2022-08-04
Version of Record valid from 2022-08-04
Article History
Received: 17 April 2022
Accepted: 17 July 2022
First Online: 4 August 2022
Declarations
:
: All authors declare that there are no competing interests.