Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives
Crossref DOI link: https://doi.org/10.1186/S40539-014-0010-9
Published: 2014-12
Update policy: https://doi.org/10.1007/SPRINGER_CROSSMARK_POLICY
Ren, Hu-Ming
Zhang, Kai
Matthew, Yuen MF
Fu, Xian-Zhu
Sun, Rong
Wong, Ching-Ping
unspecified valid from 2014-09-08